A reworkable adhesive-free interconnection technology for microfluidic systems


AU: 
Pan, T.; Baldi, A.; Ziaie, B.
SO: 
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
Autores del GTQ: 
VL: 
15
IS: 
1
BP: 
267
EP: 
272
PY: 
2006
SN: 
1057-7157
Impact: 
2.66
Año IF: 
2006
Resumen: 

In this paper, we present a simple adhesive-free interconnect technology for microfluidic systems. Reliable connection between microfluidic devices and macroscopic world is a critical issue in many lab-on-a-chip applications. In such interconnections, it

DT: 
Article en revistes indexades
Percentil: 
HIGH
Año Percentil: 
2006
Categoría: 
ENGINEERING, ELECTRICAL & ELECTRONIC