Improving silicon integrated antennas by substrate micromachining: a study of etching patterns


AU: 
Gemio, J; Parron, J; De Paco, P; Sacristan, J; Baldi, A
SO: 
PROGRESS IN ELECTROMAGNETICS RESEARCH-PIER
Autores del GTQ: 
VL: 
117
BP: 
365
EP: 
378
PY: 
2011
SN: 
1559-8985
Impact: 
3.75
Año IF: 
2010
Resumen: 

One of the main drawbacks of antenna integration on standard CMOS silicon substrates are the low radiation efficiency levels obtained due to the high silicon losses. This paper studies the use of micromachining techniques to remove silicon beneath the antenna as a solution to improve radiation efficiency. Several etching patterns are analyzed for different etching depths through simulations and measurements in order to find out which are the best ones for the micromachining process. Results are verified in two operating scenarios.

DT: 
Article en revistes indexades
Percentil: 
HIGH
Año Percentil: 
2010
Categoría: 
ENGINEERING, ELECTRICAL & ELECTRONIC