UV laser-induced high resolution cleaving of Si wafers for micro-nano devices and polymeric waveguide characterization


AU: 
Casquel, R; Holgado, M; Garcia-Ballesteros, JJ; Zinoviev, K; Fernandez-Sanchez, C; Sanza, FJ; Molpeceres, C; Laguna, MF; Llobera, A; Ocana, JL; Dominguez, C
SO: 
APPLIED SURFACE SCIENCE
Autors del GTQ: 

Línies d'Investigació:

VL: 
257
IS: 
12
BP: 
5424
EP: 
5428
PY: 
2011
SN: 
0169-4332
Impact: 
1.79
Any IF: 
2010
Resum: 

In this work we propose a method for cleaving silicon-based photonic chips by using a laser based micro-machining system, consisting of a ND: YVO4 laser emitting at 355nm in nanosecond pulse regime and a micropositioning system. The laser makes grooved marks placed at the desired locations and directions where cleaves have to be initiated, and after several processing steps, a crack appears and propagate along the crystallographic planes of the silicon wafer. This allows cleavage of the chips automatically and with high positioning accuracy, and provides polished vertical facets with better quality than the obtained with other cleaving process, which eases the optical characterization of photonic devices. This method has been found to be particularly useful when cleaving small-sized chips, where manual cleaving is hard to perform; and also for polymeric waveguides, whose facets get damaged or even destroyed with polishing or manual cleaving processing. Influence of length of the grooved line and speed of processing is studied for a variety of silicon chips. An application for cleaving and characterizing sol-gel waveguides is presented. The total amount of light coupled is higher than when using any other procedure. (C) 2010 Elsevier B.V. All rights reserved.

Percentil: 
MEDIUM
Any Percentil: 
2010
Categoria: 
PHYSICS, APPLIED
KW: 
Laser cleaving; Micro nano photonic chips; Polymeric waveguides; Silicon fracture